Corn processing by pulsed electric fields with respect to microbial inactivation and improvement of seed vigour
Yükleniyor...
Dosyalar
Tarih
2024
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Elsevier
Erişim Hakkı
info:eu-repo/semantics/openAccess
Özet
Pulsed electric field (PEF) treatment of corn grains to improve seed vigour and inactivation of endogenous microflora by energies ranging from 1.20 to 28.8 J were applied to determine effectiveness of applied energies on germination rate (GR), normal seedling rate (NSR), electrical conductivity (EC), ability to germinate under salt (100- and 200 mM salt) and cold (at 10 °C for 7 days and at 25 °C for 5 days) stresses. Moreover, the effect of PEF treatments was further investigated for the inactivation of total aerobic mesophilic bacteria (TAMB), total mold and yeast (TMY), and inactivation rate (%) of Aspergillus parasiticus. Increased energy provided 11.10 % increase in GR, 21.22 % increase in NSR, 95.50 % increase in germination at 10 °C for 7 days. Germination under stress conditions revealed 32.53 %, 68.35 %, and 76 % increase in germination at 25 °C for 5 days, under 100 mM- and 200 mM NaCI salt stresses. Inactivation on the mean initial TAMB and TMY were approximately 9.25 and 7.93 log, respectively, with 63.33 ± 0.22 % reduction in A. parasiticus culture. PEF treated corn seedlings had stronger and taller body formation with stronger roots. The most optimal processing parameters were detected as 300 Hz, 28.80 J, and 19.78 sec. PEF treatment carries a high potential to improve corn vigour with inactivation of surface microflora.
Açıklama
Anahtar Kelimeler
Corn, Corn vigour, Microbial inactivation, Pulsed electric fields, Stress tolerance
Kaynak
Computers and Electronics in Agriculture
WoS Q Değeri
N/A
Scopus Q Değeri
Q1
Cilt
219
Sayı
Künye
Akdemir Evrendilek, G., Atmaca, B., & Uzuner, S. (2024). Corn processing by pulsed electric fields with respect to microbial inactivation and improvement of seed vigour. Computers and Electronics in Agriculture, 219, 108830. https://doi.org/10.1016/j.compag.2024.108830
